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XYALIS new version of GTmuch makes multi-chip modules and multi-project wafers even easier

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Paris, France – Xyalis has announced a major upgrade to GTmuch, the company’s graphical tool dedicated to floorplanning and assembly of multiple GDSII databases for Multi-Chip Modules (MCM) and Multi-Project Chips or Wafers (MPC or MPW). At the same time Xyalis has updated its complete suite of GDSII utilities.