| ARRAY | Defines either a matrix of DIEs in a FIELD when a PRODUCT is repeated, either a matrix of FIELDs on a MASK |
| BARCODE | One of the MARKERs dedicated to MASK identification |
| BLANK | Physical substrate used for mask writing |
| CD | Pattern for Control of Dimensions placed in a FIELD. A CD can be inside or outside of a DEVICE |
| CHIP | Physical piece of silicon corresponding to the PRODUCT on processed WAFER |
| DATABASE | Graphic description of a DEVICE within a file. The most common file format are GDSII, OASIS©, OASIS.MASK© and MEBES |
| DEVICE | One of the structures written on a MASK. A DEVICE can be of type DIE, FRAME, MARKER,.... |
| DIE | The pattern corresponding to one CHIP on a mask MASK. A DIE is always contained in a FIELD |
| FIDUCIAL | A kind of MARKER dedicated to mask alignment |
| FIELD | Area of a MASK used for photo exposure. A MASK may contain multiple FIELDs |
| FRAME | Set of ITEMs used during wafer processing and placed around the DIEs within a FIELD |
| ITEM | One of the patterns of the FRAME. An item may be used for mask alignment, process control monitoring, identification, etc... |
| JOB DECK | Placement description of all the various patterns on a BLANK |
| JOB REQUEST | Request submitted by the designers to build all the masks needed to process a given PRODUCT |
| KERF | Other name of FRAME |
| LAYER | Graphic description of one step of WAFER processing within original design DATABASE |
| LEVEL | One photolithography step for WAFER processing. A graphic LEVEL description may be deduced from the various LAYERs. One LEVEL is related to at least one FIELD. glossary/ glossary/One MASK may contain multiple LEVELS (MLR) |
| MARKER | Pattern used for identification, fabrication or alignment of the MASK. A MARKER is not printed on the wafer. It is outside of any FIELD. |
| MASK | Physical media used for photolithography (a processed BLANK) |
| MASK REQUEST | Request submitted by mask data prep to the Mask Shop |
| MASK SET | A set of different MASKs used to process different levels of the same CHIP |
| MASK SHOP | Also known as MASK HOUSE. Performs all physical mask processing: writing, inspection, cleaning |
| MDP | Mask Data Prep: data processing of all files prior to mask writing: FRAME generation, fracturing, etc... |
| MLR | Multi Level Reticle. Techniques using multiple fields on a same mask. Each FIELD represents a different LEVEL |
| OPC | Optical Proximity Correction. Data processing performed on elementary geometries to compensate optical distortions (diffraction...) |
| OVERLAY | Coincidence of the patterns on 2 different MASKs of a same SET. See REGISTRATION |
| PCM | Process Control Module: a structure used during or after wafer processing to qualify the different parameters of the process. PCM are placed in a FIELD, either in the SCRIBES of a DIE array or in a separate FIELD |
| PROCESS | The multiple steps for WAFER fabrication |
| PRODUCT | A kind of DEVICE delivered by designers to produce a silicon CHIP |
| REGISTRATION | Measure of OVERLAY errors between 2 masks |
| RET | Reticle Enhancement Technology. Methods to improve optical resolution of MASKs |
| RETICLE | An other name for MASKs. Usually RETICLE is used for MASKs with photo-repetition |
| SCRIBE | Gap between 2 adjacent DIEs on a wafer. SCRIBEs are destroyed when sawing the wafer but may contain any ITEM useful during PROCESS |
| STEP | Distance between the centers of two identical patterns. We can differentiate the DIE STEP which is the distance between the centers of 2 adjacent CHIPS on the wafer and the PHOTO STEP which is the move of the stepper between 2 photo shots |
| TECHNOLOGY | Another name for PROCESS |
