News & Press
News & Press subtitle
XYALIS at DAC Conference 2025: #booth 2628
3D-ICs, stitching, MPWs, PCMs, multi-patterning, or density management create disruptions, bottlenecks, and inefficiencies in your existing Mask Data Preparation flow? Visit XYALIS @DAC to learn how XYALIS transforms Mask Data Preparation with end-to end automation from specs to masks, and …
Leveraging the Advantages of OASIS Files
The OASIS format (Open Artwork System Interchange Standard) was introduced to address the growing complexity of chip design layouts and to overcome the limitations of the aging GDSII format. While it offers immense potential for more compact, efficient layout descriptions, …
XYALIS at SPIE Photomask conference 2024
Time to update your Mask Data Preparation flow? XYALIS offers cutting-edge MDP solutions tailored to your workflow. Work with our customer oriented team to boost your MDP productivity through customized, production-proven engines that seamlessly integrate with your existing flow. From …
XYALIS at DAC Conference 2024: #booth 2516
XYALIS celebrates 26 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching, mask order form generation, chip …
Beyond tape-out: open the dark side
XYALIS is excited to announce its participation in the FSiC2024 Free Silicon Conference in Paris, Sorbonne University, on June 20th, 2024. We will be presenting an article titled “Beyond Tape-Out: Exploring the Dark Side.” While the various steps of chip …