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Beyond Tapeout: Opening the Dark Side of Mask Data Preparation

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How XYALIS Bridges the Critical Automation Gap from Design to Manufacturing Abstract The transition from design completion (tapeout) to chip fabrication is often presented as seamless, almost magical. However, this perception overlooks a critical reality: a physical mask set must …

Versions history

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Here is our tools versions history: GOTsuite_2409-30   Product name Version GOTarc 1.1c GOTcheck 1.6b GOTcif2db 2.2d GOTcross 3.1c GOTcsv2mch 2.1a GOTdb2cif 1.2c GOTdb2ps 1.2d GOTdeck 1.0b GOTdiff 1.4b GOTfig 2.1e GOTfiller 3.2d GOTframe 5.2a GOTghost-shape 2.0e GOTjob2msk 4.4b GOTlabel …

Minimizing die fracture in three-dimensional IC

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XYALIS, in collaboration with Mosis, has published an article about “Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns”. This result has been presented in the SPIE Advanced Lithography + Patterning, San Jose, California, …

Single-pass frame generation for multi-layer 3D circuits

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XYALIS, in collaboration with ST Microelectronics,  has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been presented in the SPIE Photomask …

Design Driven Dummy Filling

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XYALIS has set up a new methodology to allow an efficient design driven dummy filling technique. It is used in our dummy filling tool GOTstyle. The result has been presented in a paper during the 2021 International Symposium on Electrical, Electronics …



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