Mask Data Preparation
- Generation of Multi Project Wafers (MPWs) or shuttles
- Generation of complex reticles
- Intuitive mask set creation
Dummy Filling
- 3rd Generation of dummy filling
- High speed parallel processing
- Available at chip level, reticle level or wafer level
Toolbox
- Powerful toolbox for GDSII, OASIS ®, Mebes operations
- High reliability for last minute updates
- Secure your tapeout
XYALIS at SPIE Photomask conference 2024
October 1st, 2024
Time to update your Mask Data Preparation flow?
XYALIS offers cutting-edge MDP solutions tailored to your workflow. Work with our customer oriented team to boost your MDP productivity through customized, production-proven... [Continue Reading]
News & Press
XYALIS at DAC Conference 2024: #booth 2516
June 24th, 2024 - News XYALIS celebrates 26 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching,... [Continue Reading]
Beyond tape-out: open the dark side
June 6th, 2024 - News XYALIS is excited to announce its participation in the FSiC2024 Free Silicon Conference in Paris, Sorbonne University, on June 20th, 2024. We will be presenting an article titled “Beyond Tape-Out: Exploring the Dark Side.” While... [Continue Reading]
Minimizing die fracture in 3DIC die integration
January 3rd, 2024 - News XYALIS, in collaboration with Mosis, has published a new article in the Journal of Micro/Nanopatterning, Materials, and Metrology about “Minimizing die fracture in 3DIC die integration”. The demand for high-performance semiconductor products has led to... [Continue Reading]
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To build reliable flows involving data exchange with other tools and equipments, XYALIS is fully compliant with SEMI standards. |
