News & Press
News & Press subtitle
XYALIS at DAC conference 2023 : booth #2455
XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching, mask order form generation, chip …
Minimizing die fracture in three-dimensional IC
XYALIS, in collaboration with Mosis, has published an article about “Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns”. This result has been presented in the SPIE Advanced Lithography + Patterning, San Jose, California, …
Single-pass frame generation for multi-layer 3D circuits
XYALIS, in collaboration with ST Microelectronics, has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been presented in the SPIE Photomask …
November’22: New Release
Grenoble – November 30th, 2022 – Today XYALIS unveils a new release bringing powerful improvements in the frame generation engine (GOTframe) and other tools. GOTframe – Frame Assembly Generation Engine Add new ordering items possibilities. Add new centering items capabilities. …
XYALIS at SPIE Photomask 2022 : Single-pass frame generation for multi-layer 3D circuits
XYALIS will present a paper about “Single-pass frame generation for multi-layer 3D circuits” at the poster session. This paper presents a novel approach to automatically build frames for 3D chips. These chips may be obtained by stacking multiple dies, but …