xyalis-logo

XYALIS at DAC Conference 2025: #booth 2628

May 15th, 2025 - ,

Revolutionizing Mask Data Preparation in the Era of Advanced Manufacturing The rapid evolution of advanced manufacturing and packaging technologies — including 3D-IC integration, die stitching, MPWs, PCMs, multi-patterning, and CMP — is reshaping the semiconductor landscape. While these innovations enable …

Read more

Leveraging the Advantages of OASIS Files

May 6th, 2025 -

The OASIS format (Open Artwork System Interchange Standard) was introduced to address the growing complexity of chip design layouts and to overcome the limitations of the aging GDSII format. While it offers immense potential for more compact, efficient layout descriptions, …

Read more
This site is registered on wpml.org as a development site. Switch to a production site key to remove this banner.