The transition from chip design to manufacturing is often seen as seamless, but mask data preparation (MDP) remains complex and under-automated. This paper explores MDP challenges and how XYALIS solutions close automation gaps to improve scalability and efficiency. Abstract The …
3D-ICs, stitching, MPWs, PCMs, multi-patterning, or density management create disruptions, bottlenecks, and inefficiencies in your existing Mask Data Preparation flow? Visit XYALIS @DAC to learn how XYALIS transforms Mask Data Preparation with end-to end automation from specs to masks, and …
The OASIS® format (Open Artwork System Interchange Standard) was introduced to address the growing complexity of chip design layouts and to overcome the limitations of the aging GDSII format. While it offers immense potential for more compact, efficient layout descriptions, not …
